The aim of the project is to develop and demonstrate how low temperature plasma can be used to treat complex plastic waste materials and thereby improve the recycling of plastic waste. Two waste samples was chosen. In case 1, etching of milk cartons, it is found that the polyethylene film on top of the cardboard could be removed by plasma etching without damaging the cardboard. In case 2, a multilayer film consists of a polyethylene-layer that is glued onto a polyamide film, where the section between the films consists of adhesive and printing layer.
Formålet med projektet er at udvikle og demonstrere, hvordan lavtemperaturplasma kan bruges til at behandle komplekse plastaffaldsmaterialer og dermed forbedre genanvendelsen af plastaffald. Der er gennemført to cases. I case 1, ætsning af mælkekartoner, hvor det viser sig, at polyethylenfilmen oven på pappet kunne fjernes ved plasmaætsning uden at beskadige pappet.
I case 2 anvendes en flerlags emballagefilm, der består af et polyethylen (PE)-lag, der er limet på en polyamid (PA) film, hvor sektionen mellem filmene består af klæbelag og tryklag.
Improved recyclability of complex plastic waste using low temperature plasma technology
The aim of the project is to develop and demonstrate how low temperature plasma can be used to treat complex plastic waste materials and thereby improve the recycling of plastic waste. Two waste samples was chosen. In case 1, etching of milk cartons, it is found that the polyethylene film on top of the cardboard could be removed by plasma etching without damaging the cardboard. In case 2, a multilayer film consists of a polyethylene-layer that is glued onto a polyamide film, where the section between the films consists of adhesive and printing layer.Formålet med projektet er at udvikle og demonstrere, hvordan lavtemperaturplasma kan bruges til at behandle komplekse plastaffaldsmaterialer og dermed forbedre genanvendelsen af plastaffald. Der er gennemført to cases. I case 1, ætsning af mælkekartoner, hvor det viser sig, at polyethylenfilmen oven på pappet kunne fjernes ved plasmaætsning uden at beskadige pappet.I case 2 anvendes en flerlags emballagefilm, der består af et polyethylen (PE)-lag, der er limet på en polyamid (PA) film, hvor sektionen mellem filmene består af klæbelag og tryklag.